X825 V2.0: Difference between revisions
| Line 10: | Line 10: | ||
The '''X825 V2.1''' was released on January 7, 2026, featuring the following improvements: | The '''X825 V2.1''' was released on January 7, 2026, featuring the following improvements: | ||
# | # '''Upgraded USB 3.0 to SATA Bridge Controller''' A new USB 3.0 to SATA bridge controller has been adopted to improve compatibility and enhance overall data transmission stability. | ||
A new USB 3.0 to SATA bridge controller has been adopted to improve compatibility and enhance overall data transmission stability. | |||
# | #'''Redesigned 4-Layer PCB''' The PCB has been upgraded to a 4-layer design, significantly improving EMC performance while enhancing heat dissipation for more stable long-term operation. | ||
The PCB has been upgraded to a 4-layer design, significantly improving EMC performance while enhancing heat dissipation for more stable long-term operation. | |||
This is the new X825 V2.0 version which release at April 1st 2020, there will be a new case [[X825-C8]] designed for X825 V2.0. The X825-C6 or X825-C7 DO NOT SUPPORT X825 V2.0. | This is the new X825 V2.0 version which release at April 1st 2020, there will be a new case [[X825-C8]] designed for X825 V2.0. The X825-C6 or X825-C7 DO NOT SUPPORT X825 V2.0. | ||