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Overview

Features

Packing List

User Manual

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Anonymous user #3

18 months ago
Score 0  
There is no bump on the heatsink for the second memory chip found on cm4 8GB
 

Anonymous user #2

29 months ago
Score 0  
This heat sink seems not to be suitable for raspberry CM4 modules, because it is not designed to cool all hot components! Namely, your heat sink has touch only to 2 of 4 components that can get very hot. The 2 not cooled ones will break within a short time with your heat sink!!!
 

Abby

29 months ago
Score 0  

Hi, Thanks for your message.

1. The main heat is from CPU, and the heat dissipation of other components is very small, so it is not necessary to put a heat sink on all the components.

2. If the heat dissipation is not achieve, pls check whether the heatsink had touched CPU.

Due to production deviation, a few heatsink may have errors and need to use 2 heat sink pads. If you encounter this problem, please use 2pcs thermal pads and stack them on the CPU of the CM4 module.

3. Pls remember to remove the protective film.

4. It is recommended to consider using CPU grease if need better heat dissipation.

Regards,

Abby / Geekworm
 

Anonymous user #1

37 months ago
Score 0  
height of cpu has changed and cpu is not connected to heatsink. requires additional thermal pad
 

Abby

29 months ago
Score 0  

Hi, The heatsink now equipped with 2pcs thermal pads. If you encounter this problem, please use 2pcs thermal pads and stack them on the CPU of the CM4 module. Pls remember to remove the protective film.

Did you get the thermal pads? Please contact the customer service of the corresponding website and the customer service will help you.

Regards,

Abby / Geekworm