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X15-C1: Difference between revisions

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Latest revision as of 10:13, 27 May 2026


X15-C1 pre-installation view
X15-C1 pre-installation view
X15-C1 installed view

Overview

The X15-C1 features a rugged two-piece metal construction designed for Compute Module 5 and X1500/X1501 IO boards. Its precision structural design combined with an efficient heat dissipation system ensures stable and reliable operation. Ideal for industrial, embedded, and high-performance computing applications, the X15-C1 delivers a perfect balance of protection, cooling, and accessibility.

The X15-C1 case provides flexible expansion options, including: an 80×10mm PWM-controlled cooling fan (X15-F1) that delivers 19.68 CFM for active thermal management in high-power applications; an X15-POE+ HAT supporting 802.3at Power-over-Ethernet for simplified cabling; and compatibility with additional low-profile HATs.

Features

  • Form factor: 96mm x 90mm x 44mm
  • Precision cut-outs & clear labeling: Ensures easy access to ports and components with intuitive identification.
  • Optimized thermal performance: Extensive ventilation holes on every side enhance heat dissipation.
  • Comprehensive port access: Side cut-outs provide unobstructed access to HDMI, Ethernet, USB-A, USB-C (power input), and the SD card slot.
  • Expandable connectivity: Features a bottom slot for seamless integration of CSI-2 cameras or DSI displays.
  • Wireless antenna support: Includes a dedicated mounting hole for an external antenna.
  • Offers flexible configuration options: X15-F1 8010 PWM-controlled fan, X15-POE+ HAT and other low-profile expansion HATs.
  • SSD Note: Does not support SSD heatsink installation

Technical Specification

  • Form factor: 96mm x 90mm x 44mm
  • Weight: Approx 230g
  • Product material: Sheet metal

Packing List

  • 1 x X15-C1 Metal case
  • 4 x M3 screws
  • 4 x M2.5x5mm screws

User Manual

FAQ