X15-C1: Difference between revisions
Replace <comments/> with <comment-streams /> |
|||
| (2 intermediate revisions by 2 users not shown) | |||
| Line 6: | Line 6: | ||
==Overview== | ==Overview== | ||
The X15-C1 features a rugged two-piece metal construction designed for Compute Module 5 and '''X1500/X1501''' IO boards. Its precision structural design combined with an efficient heat dissipation system ensures stable and reliable operation. | The X15-C1 features a rugged two-piece metal construction designed for Compute Module 5 and '''[[X1500]]/[[X1501]]''' IO boards. Its precision structural design combined with an efficient heat dissipation system ensures stable and reliable operation. | ||
Ideal for industrial, embedded, and high-performance computing applications, the X15-C1 delivers a perfect balance of protection, cooling, and accessibility. | Ideal for industrial, embedded, and high-performance computing applications, the X15-C1 delivers a perfect balance of protection, cooling, and accessibility. | ||
The X15-C1 case provides flexible expansion options, including: an 80×10mm PWM-controlled cooling fan ('''X15-F1''') that delivers 19.68 CFM for active thermal management in high-power applications; an''' X15-POE+ HAT''' supporting 802.3at Power-over-Ethernet for simplified cabling; and compatibility with '''additional low-profile HATs'''. | The X15-C1 case provides flexible expansion options, including: an 80×10mm PWM-controlled cooling fan ('''[[X15-F1]]''') that delivers 19.68 CFM for active thermal management in high-power applications; an''' X15-POE+ HAT''' supporting 802.3at Power-over-Ethernet for simplified cabling; and compatibility with '''additional low-profile HATs'''. | ||
==Features== | ==Features== | ||
| Line 66: | Line 66: | ||
<!--Add review function! --> | <!--Add review function! --> | ||
< | <comment-streams id="main" /> | ||
<!--Please choose the --> | <!--Please choose the --> | ||