Changes

The X15-C1 features a rugged two-piece metal construction designed for Compute Module 5 and '''X1500/X1501 ''' IO boards. Its precision structural design combined with an efficient heat dissipation system ensures stable and reliable operation.

The X15-C1 case provides flexible expansion options, including: an 80×10mm PWM-controlled cooling fan ('''X15-F1''') that delivers 19.68 CFM for active thermal management in high-power applications; an ''' X15-POE+ HAT ''' supporting 802.3at Power-over-Ethernet for simplified cabling; and compatibility with '''additional low-profile HATs'''.

* Form factor: 96mm x 90mm x 44mm * Precision cut-outs & clear labeling: Ensures easy access to ports and components with intuitive identification. * Optimized thermal performance: Extensive ventilation holes on every side enhance heat dissipation. * Comprehensive port access: Side cut-outs provide unobstructed access to '''HDMI''', '''Ethernet''', '''USB-A''', '''USB-C''' (power input), and the '''SD card slot'''. * Expandable connectivity: Features a bottom slot for seamless integration of '''CSI-2 cameras '''or '''DSI displays'''.  * Wireless antenna support: Includes a dedicated mounting hole for an external '''antenna'''.  * Offers flexible configuration options: '''X15-F1''' 8010 PWM-controlled fan,''' X15-POE+ HAT''' and other '''low-profile expansion HATs'''. * SSD Note: Does not support SSD heatsink installation ==Technical Specification== *Form factor: 96mm x 90mm x 44mm *Weight: Approx 230g

X15-C1 Case Form factor: 96mm x 90mm x 44mmWeight: Approx 230g*Product material: Sheet metal

* Hardware Installation: https://suptronics.com/Raspberrypi/cm5/x15-c1_assembly.html