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# ''' Redesigned 4-Layer PCB'''; The PCB has been upgraded to a 4-layer design, significantly improving EMC performance while enhancing heat dissipation for more stable long-term operation.
The X825 V2.0 version was released on April 1st, 2020. There is a new case [[X825-C8]] designed for X825 V2.0/V2.1. X825-C6 and X825-C7 are NOT compatible with X825 V2.0.
The X825 V2.0 Version is updated from [[X825]] V1.5 Version.