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* Silicone grease is used to conduct heat at the widened position of the upper and lower covers, so that the heat can be quickly conducted from the upper cover to the lower cover, making the heat dissipation capacity of the entire shell better.
N311
,* Aluminum alloy shell, ultra-thin design, all CNC equipment manufacturing.
* Compared with the same product N300 used for Raspberry Pi 4, we widened the shell to get better heat dissipation effect.
* The bottom chessboard style design increases the heat dissipation area.
* Other HAT expansion boards can be installed on the shell. It should be noted that you need to choose the right accessories such as copper columns or FPC lines to match your HAT expansion board.