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	<title>CommentStreams:8e2545008bc86782b1d98007ea46f54b - Revision history</title>
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	<updated>2026-06-25T08:50:55Z</updated>
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		<title>79.193.105.217: Migrated comment #4074</title>
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		<updated>2023-10-13T19:08:56Z</updated>

		<summary type="html">&lt;p&gt;Migrated comment #4074&lt;/p&gt;
&lt;p&gt;&lt;b&gt;New page&lt;/b&gt;&lt;/p&gt;&lt;div&gt;Was thermal paste also used between the cpu and the copper plate or only between the copper plate and the heat sink? Do you have data on the differences between the use of the copper plate and the thermal pad?&amp;lt;!-- migrated from Comments; original IP: 79.193.105.217 --&amp;gt;&lt;/div&gt;</summary>
		<author><name>79.193.105.217</name></author>
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